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Visit DEZSMART at NEPCON ASIA 2026, Shenzhen (27–29 Oct, Booth 13F25). See PCBA cleaning machines, stencil cleaning machines and selective soldering systems, and test your samples at our nearby facility.

  A PCBA can look perfectly clean and still contain residues that affect long-term reliability.   After soldering and assembly, a board may carry flux residues, ionic contamination, dust, handling residues and other process-related contaminants.

In SMT manufacturing, up to 65% of printing defects are traceable to the stencil – clogged apertures, residual paste, edge burrs, or subtle wear. While automated 3D solder paste inspection (SPI) checks the printed deposit,

In SMT production, residual flux, solder balls, ink and dust left on PCBA boards after soldering are key factors affecting long-term product reliability. Incomplete cleaning can lead to electrochemical migration, corrosion and even short circuits

1. Industry Challenges In modern electronics manufacturing, PCB assemblies are becoming increasingly complex, with a mix of SMT and through-hole components on high-density boards. Traditional wave soldering processes face several critical challenges: · Excessive thermal stress

In today’s electronics manufacturing landscape, as PCB integration becomes increasingly dense, traditional full-board Wave Soldering faces significant challenges. This is especially true when a board contains both Surface Mount Devices (SMD) and Through-Hole Technology (THT)