1. Product Overview
The DEZ-H3960A, a flagship in-line selective wave soldering machine from Shenzhen DEZSMART Intelligent Technology Co., Ltd., is engineered to maximize productivity while maintaining precision in electronics manufacturing. This all-in-one system integrates flux spraying, preheating, and soldering into a single modular unit, with the unique capability to process 3 PCBs or carriers simultaneously—one in flux spraying, one in preheating, and one in soldering.
Featuring independent motion platforms for fluxing (XY axis) and soldering (XYZ axis), the machine ensures non-interfering operations, boosting throughput without compromising accuracy. Controlled entirely via a Windows-based PC system, it stores critical parameters (e.g., solder temperature, nitrogen flow, motion paths) for full traceability, making it ideal for high-volume, high-quality production lines.
2. Application Scope
The DEZ-H3900A is optimized for industries requiring large PCB handling and high productivity:
- Automotive Electronics: Large control modules (e.g., ADAS systems, engine controllers) and infotainment PCBs, where size and reliability are critical.
- Industrial Control: Large-scale machinery circuit boards, power management panels, and robotics PCBs with dense solder joints.
- Telecommunications: Network infrastructure boards (e.g., base station PCBs) and server motherboards, often exceeding standard sizes.
- Aerospace & Defense: Avionics and defense electronics with large, mission-critical PCBs demanding precision and traceability.
3. Working process
The DEZ-H3900A follows a synchronized, automated workflow to maximize efficiency:
- In-Line Loading: PCBs enter via SMEMA-compliant conveyors, secured by side clamping systems to prevent displacement.
- Triple Parallel Processing:
- Selective Flux Spraying: An XY motion platform with an imported piezoelectric jet valve (compatible with fluxes <10% solid content) applies flux to target areas with ±0.05mm accuracy.
- Dual-Side Preheating: Upper hot air and bottom IR heaters (6kW) warm the PCB to 25–240°C, with adjustable heating ratios (0–100%) to activate flux.
- Precision Soldering: An XYZ motion platform operates a 13kg titanium alloy solder pot (electromagnetic pump) with customizable nozzles (3mm, 4mm, 5mm, 6mm, 8mm). Nitrogen heating (up to 350°C) minimizes oxidation, ensuring clean joints.
- In-Line Unloading: Completed PCBs exit sequentially, maintaining continuous production flow.
4. Core Advantages
The DEZ-H3900A outperforms conventional machines, with distinct advantages over the DEZ-H3800S:
| Feature | DEZ-H3900A | DEZ-H3800S |
|---|
| Processing Capacity | 3 PCBs simultaneously (parallel workflow) | 1 PCB at a time (sequential workflow) |
| Max PCB Size | 500x600mm | 400x400mm |
| Motion Platforms | Independent XY (fluxing) + XYZ (soldering) | Single XYZ platform (fluxing + soldering) |
| Throughput | Ideal for high-volume production (e.g., 900+ boards/hour) | Suited for medium-volume production (e.g., 400–600 boards/hour) |
| Conveyor Design | Dual systems: chain (flux/preheat) + rollers (soldering) | Single conveyor system |
Additional standout advantages:
- Large Format Compatibility: Handles 500x600mm PCBs, exceeding most industry standards.
- Precision Engineering: Panasonic servo motors and Hiwin ball screws ensure ±0.05mm positioning accuracy.
- Smart Maintenance: Automatic nozzle cleaning (adjustable timing) reduces downtime.
- Full Traceability: All parameters stored in PC files for easy audits and process replication.
5. Product Structure
The DEZ-H3900A features a modular, durable design with key components:
Industrial PC, dual motion controllers, real-time monitoring camera, and Windows 7-based software for intuitive operation.
- Fluxing: Full aluminum XY platform with servo motors (Panasonic), ball screws (Hiwin), and dust-proof plates.
- Soldering: Full aluminum XYZ platform with the same high-precision components for 3D movement.
Upper hot air + bottom IR heaters (6kW) with adjustable temperature (25–240°C).
13kg titanium alloy pot (electromagnetic pump) with nitrogen heating, over-temperature/level alarms, and 5 standard nozzles.
Stainless steel chain (fluxing/preheating) and roller (soldering) transport with independent stepper drives, supporting up to 10kg load and 3mm board edge access.
6.Work Case
A leading industrial control manufacturer producing 480x550mm machinery PCBs faced bottlenecks with their old system, achieving only 300 boards/hour with 12% rework. After adopting the DEZ-H3900A:
- Throughput tripled to 900+ boards/hour due to triple parallel processing.
- First-pass yield rose from 88% to 97% thanks to independent motion platforms reducing interference.
- Ability to handle full-size PCBs eliminated panel splitting, cutting production time by 35%.
The DEZ-H3900A redefines high-volume, large-format selective wave soldering. Its triple parallel processing, independent motion platforms, and large PCB compatibility make it the ideal choice for industries scaling production of big, complex boards. For manufacturers prioritizing throughput without compromising precision, the DEZ-H3900A delivers unmatched value.
Contact Shenzhen
DEZSMART to optimize your large PCB soldering line with the DEZ-H3900A.
