1. Industry Challenges
In modern electronics manufacturing, PCB assemblies are becoming increasingly complex, with a mix of SMT and through-hole components on high-density boards. Traditional wave soldering processes face several critical challenges:
· Excessive thermal stress damaging sensitive components
· Solder bridging and insufficient solder joints
· Inability to target specific solder points
· High oxidation and solder dross in open-air processes
· Low flexibility for small-batch or high-mix production
These challenges directly impact product quality, yield rate, and long-term reliability.
2. Solution Overview
The DEZ-H3500A Selective Wave Soldering System is designed to address these challenges through precision-controlled, point-to-point soldering using a programmable XYZ motion platform.
It integrates:
· Selective fluxing
· Precision soldering
· Nitrogen protection system
· Full PC control and traceability
This enables high-quality, repeatable soldering for complex PCB assemblies.
3. Core Technology
3.1 XYZ Motion Control
The system utilizes a high-precision XYZ motion platform with:
· Stepper motor + ball screw structure
· ±0.1 mm positioning accuracy
· Smooth and stable movement
This ensures accurate soldering paths for every joint.
3.2 Intelligent Software System
· Full PC-based control (Windows system)
· Visual path programming using PCB images
· Parameter traceability and storage
· Real-time monitoring (temperature, speed, pressure)
3.3 Selective Fluxing System
· Precision jetting valve for accurate flux application
· Stable pressure system independent of flux volume
· Compatible with various flux types
3.4 Nitrogen-Protected Soldering
· Inline nitrogen heating system
· Reduces oxidation and solder dross
· Improves wetting performance
3.5 Advanced Solder Pot Design
· Titanium alloy stainless steel pot
· No leakage, high durability
· Uniform heating with external heating plate
4. Key Advantages
· All-in-one compact design
· High soldering quality and consistency
· Flexible offline operation (can be placed beside SMT line)
· Easy programming and fast changeover
· Ideal for high-mix, low-volume production
5. Key Specifications
Item | Specification |
Model | DEZ-H3500A |
PCB Size | Max 420 × 320 mm (customizable) |
PCB Thickness | 0.2 – 6 mm |
Position Accuracy | ±0.1 mm |
Solder Pot Capacity | 10–15 kg |
Max Temperature | 350°C |
Power Supply | 220V / 50Hz |
Total Power | 3 kW |
Machine Weight | 380 kg |
Nitrogen Purity | ≥99.998% |
6. Application Scenarios
· Automotive electronics
· Industrial control systems
· Power electronics
· LED lighting
· Communication equipment
7. Conclusion
Selective wave soldering is becoming a critical process for modern electronics manufacturing. The DEZ-H3500A provides a flexible, precise, and reliable solution to meet increasing quality demands.












