In the rapidly evolving world of semiconductor assembly, precision is the dividing line between high-yield success and costly rework. As IC packages become more complex, manual reballing methods struggle to keep pace with modern quality standards. The DEZ-ZQ1800 by DEZSMART is designed to bridge this gap, offering a high-precision, semi-automatic solution for batch chip reballing.
Why the DEZ-ZQ1800 is a Game-Changer for SMT Lines
The DEZ-ZQ1800 is a specialized dual-function system that integrates both solder paste printing (tinning) and solder ball placement. By moving away from purely manual processes, manufacturers can significantly enhance production efficiency while maintaining strict quality control.
Technical Excellence in Every Micron
Accuracy is the heartbeat of the DEZ-ZQ1800. The system boasts:
Repeat Positioning Accuracy: ±12um.
Printing/Reballing Precision: ±15um
Pitch Capability: Supports a minimum pitch of 0.3mm.
Ball Diameter: Compatible with solder balls as small as 0.2mm.
Advanced Features for Professional Rework
Intelligent Control System: Powered by an HMI + PLC interface , the machine automates critical movements to save costs and standardize quality.
Precision Demolding: An imported electric lifting platform controls the separation between the mold and the stencil. Users can customize demolding speeds from 0.1 to 15mm/sec to achieve the perfect release for various chip types.
Secure Chip Handling: To prevent movement during the reballing cycle, the system utilizes a combination of positioning frames and built-in vacuum adsorption.
Universal Packaging Support: Whether you are working with BGA, CSP, QFN, SOP, TSOP, or TSSOP packages, the DEZ-ZQ1800 provides the versatility needed for diverse production environments.
Versatile Industry Applications
The DEZ-ZQ1800 is a vital asset across a wide spectrum of electronic manufacturing sectors, including:
Consumer Electronics: Mobile phones, LCD TVs, and Home Theater systems.
High-Reliability Sectors: Aerospace, Aviation, and Medical equipment.
Automotive & Industrial: Car electronics and power equipment.
FAQ:
Q1: What are the primary advantages of the PLC control system in the DEZ-ZQ1800?
A: The HMI+PLC operating system significantly improves production efficiency and ensures consistent quality by automating the electric lifting platform and stencil positioning. This reduces human error and lowers long-term operational costs compared to fully manual setups.
Q2: How does the machine accommodate chips of different thicknesses?
A: The DEZ-ZQ1800 features an electric lifting platform that allows the operator to adjust for varying chip thicknesses. This flexibility, combined with the one-piece molded fixture positioning system, ensures that the stencil is always accurately aligned regardless of the component profile.
Q3: Does the DEZ-ZQ1800 require an external vacuum source for chip fixation?
A: No, the machine comes equipped with its own built-in vacuum pump. This allows for secure chip fixation via vacuum adsorption and positioning frames without the need for additional external infrastructure.
