Máquina neumática de limpieza de esténciles: 3 avances clave en la eliminación de pasta de soldadura sin lead
In the field of electronics manufacturing, the widespread use of lead-free solder paste has brought environmental improvements, but also created new cleaning challenges. When dealing with lead-free solder paste waste, traditional solvent-based cleaning agents not only face material compatibility risks (such as nickel/silver plating corrosion) but also face compliance pressure due to excessive VOC emissions. […]