In today’s electronics manufacturing landscape, as PCB integration becomes increasingly dense, traditional full-board Wave Soldering faces significant challenges. This is especially true when a board contains both Surface Mount Devices (SMD) and Through-Hole Technology (THT) components with minimal spacing. How can you ensure soldering quality without damaging heat-sensitive components?
DEZSmart’s Turnable Selective Wave Soldering (DEZ-H3100A) is engineered precisely for this purpose.
Why Selective Soldering is the Future of SMT Lines
Unlike traditional wave soldering, which submerses the entire board in a solder bath, selective soldering uses a programmable nozzle to apply flux, preheat, and solder only specific joints.
Zero Damage Risk: Localized heating protects heat-sensitive SMD components located in close proximity to the solder joints.
Process Flexibility: Soldering parameters for each individual joint—such as flux volume, soldering time, and wave height—can be independently adjusted.
Cost and Eco-Efficiency: Under Nitrogen (N2) protection, localized soldering significantly reduces solder dross and eliminates the need for expensive soldering pallets.
DEZ-H3100A: Compact Powerhouse for Precision Soldering
Based on our latest technical specifications, the DEZ-H3100A is a turnable selective soldering machine designed for high flexibility and small-to-medium batch production. Here are its core technical advantages:
Premium Hardware Configuration: The DEZ-H3100A features industry-leading motion control systems, including Mitsubishi Servo Motors and Hiwin Guide Rails, ensuring extreme repetitive positioning accuracy within the 110 x 80mm soldering area.
Efficient Turnable Structure: The unique turnable (rotary) design allows operators to load and unload boards while the machine is soldering, significantly shortening the production cycle time.
Intelligent Control System: Equipped with a Xinjie Touch Screen and PLC Controller, the interface is intuitive. Engineers can easily perform offline programming via a computer or video teaching device.
Technical Specifications (DEZ-H3100A):
Solder Pot Capacity: 13KG
Max Temperature: 350℃ (Customizable)
Positioning System: Magnet-type Nozzle / Mitsubishi Servo
Flux Capacity: 5L
Power Supply: Single Phase 220V 50HZ
Machine Weight: Approx. 500KG
Dimensions: L1450mm x W1350mm x H1680mm
Applications: From Consumer Electronics to Industrial Control
The DEZ-H3100A is particularly effective in sectors requiring high-precision soldering:
Complex Multi-layer PCBs: Solving issues with fast heat dissipation and high through-hole penetration requirements.
Double-sided Mixed Assembly: Avoiding secondary reflow impact on components on the reverse side.
Non-standard Custom Production: Nozzles can be quickly swapped via magnetic attachment to fit various product sizes.
Conclusion
In the pursuit of “Zero-Defect Soldering,” the DEZ-H3100A offers a high-performance, cost-effective solution for electronic manufacturing service (EMS) providers. If you are looking to improve your PCBA soldering yield and reliability, the DEZSmart expert team is ready to support you.
FAQ:
Q1: Is selective wave soldering slower than traditional wave soldering? A: Theoretically, yes, because it solders point-by-point. However, when you consider that it requires no masking tape, no expensive pallets, and results in a near-zero repair rate, its total efficiency for complex boards far exceeds traditional methods.
Q2: How often does the DEZ-H3100A require maintenance? A: Maintenance is minimal. Due to our magnet-type nozzles and optimized Nitrogen protection, solder dross generation is extremely low. Daily maintenance typically only involves checking the flux nozzle cleanliness and the solder level.
Q3: Do I need to change hardware frequently for different product sizes? A: No major hardware changes are needed. The DEZ-H3100A supports Quick-Change Magnetic Nozzles. For different solder joint pitches or sizes, you can swap the nozzle in minutes and simply load the corresponding program in the software.
